Mixed-Mode Master of Science (MSc) in Advanced Semiconductor Packaging (MQA/PSA 18788)

Offered by: School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia (USM)

✅ The ONLY MSc in Advanced Semiconductor Packaging in Malaysia

✅ Syllabus developed with multidisciplinary engineering industries

✅ Mode of Study: Full-time / Part-time

✅ Duration:

Min: 1 year (2 semesters) / 2 years (4 semesters)
Max: 2 years (4 semesters) / 4 years (8 semesters)

📌 Admission Requirements:

Bachelor’s Degree in Science, Technology, or Engineering
Or APEL (A) Level 7 qualification

📚 Courses include:
Advanced Material Characterisation for Semiconductor Packaging
Product Failure Analysis & Computational Aided Engineering
Science & Engineering Research Methodology
Advanced Chip-package-board Co-design
Research Project

🔗 Apply/More Info: https://share.google/t74l8GxPPf2u1lrb2

📞 Contact:

Assoc. Prof. Dr. Khairul Anuar Shariff (Deputy Dean)

✉ Email: This email address is being protected from spambots. You need JavaScript enabled to view it. | ☎ 04-599 6129 / 6103