Die Attachment Technology

Date: 16 Oct 2017 (Mon)


Time: 9am - 5pm


Venue: sains@usm, Persiaran Bukit Jambul, Bayan Lepas, Penang.


 


Synopsis


Die attachment is one of the important electronic packaging processes. It enables interconnection between wafer/die and substrate/lead-frame.


In this course, different type of die-attach materials and technologies will be introduce depending on the application of the packaged device. Important processing conditions that may influence the performance of a die attach process and final outcome will also be elaborated.


Effect of temperatures, electrical and mechanical requirements on the material acting as a glue to adhere the die and substrate will also be discussed briefly.


 Lastly, selection criteria of a die attach material for certain application will be shared in this course.


Please click here to view brochure.


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